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  Datasheet File OCR Text:
 ZMD-Standard
April 2002
Package LQFP44 (10 x 10)
Dimensions in millimetres Based on JEDEC JEP95: MS-026 1 Dimensions
MDS 758
Supersedes Edition 12.99
Z
A2 A
0,1
Detail Z
bp
0,2 M
44
1
D HD
Dimensions of Sub-Group B1 enom Amax bPmin bPmax HEmin HEmax HDmin HDmax LPmin 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,5 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 0,80 1,60 0,30 0,45 11,85 12,15 11,85 12,15 0,45
e
HE
E
Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* qmin qmax 0,05 0,15 1,35 1,45 0,09 0,20 9,75 10,25 9,75 10,25 0 7
* without mold-flas
Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check signed Marx Date: 30.04.2002 Quality signed Gersdorf: Doc-No. QS-000758-HD-02
A1
Lp
c
G
ZMD-Standard
April 2002
Package LQFP44 (10 x 10)
Dimensions in millimetres Based on JEDEC JEP95: MS-026 1 Dimensions
MDS 758
Supersedes Edition 12.99
Z
A2 A
0,1
Detail Z
bp
0,2 M
44
1
D HD
Dimensions of Sub-Group B1 enom Amax bPmin bPmax HEmin HEmax HDmin HDmax LPmin 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,5 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 0,80 1,60 0,30 0,45 11,85 12,15 11,85 12,15 0,45
e
HE
E
Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* qmin qmax 0,05 0,15 1,35 1,45 0,09 0,20 9,75 10,25 9,75 10,25 0 7
* without mold-flas
Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check signed Marx Date: 30.04.2002 Quality signed Gersdorf: Doc-No. QS-000758-HD-02
A1
Lp
c
G


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